| 000 | 01061nam a2200253 a 4500 | ||
|---|---|---|---|
| 001 | vtls000062029 | ||
| 003 | KUKTEM | ||
| 005 | 20251125093712.0 | ||
| 008 | 120615t2004 paudao f 001 0 eng d | ||
| 020 | _a9781558997219 | ||
| 020 | _a1558997210 | ||
| 039 | 9 |
_a201304161646 _bhuda _y201206151212 _zsafura |
|
| 040 | _aUMP | ||
| 090 | _aTK7870.15 .M38 2004 | ||
| 245 | 0 | 0 |
_aMaterials, integration and packaging issues for high-frequency devices : _bsymposium held December 1-3, 2003, Boston, Massachusetts, U.S.A. / _ceditors, P. Muralt ... [et al.] |
| 260 |
_aWarrendale, PA : _bMaterials Research Society, _c2004 |
||
| 300 |
_axiii, 232 p. : _bill. ; _c24 cm. |
||
| 490 | 1 |
_aMaterials Research Society symposium proceedings ; _vv. 783 |
|
| 504 | _aIncludes bibliographical references and indexes | ||
| 650 | 0 |
_aElectronic packaging _xMaterials _vCongresses |
|
| 700 | 1 | _aMuralt, P. | |
| 830 | 0 |
_aMaterials Research Society symposia proceedings ; _vv. 783 |
|
| 999 |
_aVIRTUA40 _c67316 _d67322 |
||
| 999 | _aVTLSSORT0080*0200*0201*0400*0900*2450*2600*3000*4900*5040*6500*7000*8300*9992 | ||