| 000 | 00975nam a2200265 a 4500 | ||
|---|---|---|---|
| 001 | vtls000065105 | ||
| 003 | KUKTEM | ||
| 005 | 20251125093831.0 | ||
| 008 | 121016t2012 gw a f 001 0 eng d | ||
| 020 | _a9783527326464 (hbk.) | ||
| 020 | _a3527326464 (hbk.) | ||
| 039 | 9 |
_a201308210946 _bsaini _y201210161130 _zsri |
|
| 040 | _aUMP | ||
| 090 | _aQC611.6.S9 H36 2012 | ||
| 245 | 0 | 0 |
_aHandbook of wafer bonding / _cedited by Peter Ramm, James Jian-Qiang Lu, Maaike M.V. Taklo |
| 260 |
_aWeinheim : _bWiley-VCH, _c2012 |
||
| 300 |
_axxxi, 395 p. : _bill. (some col.) ; _c25 cm. |
||
| 504 | _aIncludes bibliographical references and index | ||
| 650 | 0 |
_aSemiconductor wafers _vHandbooks, manuals, etc. |
|
| 650 | 0 |
_aSemiconductors _xBonding _vHandbooks, manuals, etc. |
|
| 700 | 1 | _aRamm, Peter | |
| 700 | 1 | _aLu, James Jian-Qiang | |
| 700 | 1 | _aTaklo, Maaike M. V. | |
| 999 |
_aVIRTUA40 _c68676 _d68682 |
||
| 999 | _aVTLSSORT0080*0200*0201*0400*0900*2450*2600*3000*5040*6500*6501*7000*7001*7002*9992 | ||