| 000 | 02478nmm a2200313 a 4500 | ||
|---|---|---|---|
| 001 | vtls000098454 | ||
| 003 | KUKTEM | ||
| 005 | 20251117113331.0 | ||
| 008 | 161214s2016 my fq d 001 0 eng d | ||
| 020 | _aTHE0005117(Local) | ||
| 039 | 9 |
_a201905131519 _bhanafiah _c201712081535 _dsaini _y201612141157 _zsaini |
|
| 040 | _aUMP | ||
| 090 | _aFKP .H377 2016 r Bc. | ||
| 090 | _aCD 10448 | ||
| 100 | 0 | _aWan Mohd Hasrol Wan Hasan | |
| 245 | 1 | 0 |
_aAnalysis of liquid film flow in between two different plates _h[electronic resource] / _cWan Mohd Hasrol Wan Hasan |
| 260 |
_aKuantan, Pahang : _bUMP, _c2016 |
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| 300 |
_a1 computer disc : _bdigital data ; _c12 cm. |
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| 500 | _aFaculty of Manufacturing Engineering | ||
| 500 | _aTheses Gred B | ||
| 502 | _aProject Paper (Bachelor of Engineering in Manufacturing Engineering (Hons.)) -- Universiti Malaysia Pahang – 2016 | ||
| 520 | 3 | _aIn flip chip technology, analysis of underfill flow between chip and substrate are important to prevent the chip from breaking. In other words, the welded solder balls in the packaged chip, underfill epoxy is filled into the gap between a chip and a substrate. It is because to prevent cracks on the solder bump and electrical failure resulting from thermal fatigue. This project focuses on analysis liquid film flow in between two different plates. The filling time will be analyzed to estimate the flow behavior between two parallel plates and flow pattern of liquid to fulfill entire plate. This experimnet uses four different materials which glass, perspex, aluminum and tile with dimension 25mm x 25mm for lower plates. For upper plate is fixed by using glass also with dimension 25mm x 25mm. Software Free Video to JPG Converter used to identify the time taken to fulfill and software Adobe Photoshop to calculate the distance travelled of liquid and to visualize the flow pattern during to fulfill entire plate. Glass-tile present high filling time due to its properties of surface roughness and under 300s of filling time, materials with lowest surface roughness travelled in longest distance. | |
| 538 | _aItem in PDF format | ||
| 610 | 2 | 0 |
_aFaculty of Manufacturing Engineering _xDissertations |
| 650 | 0 |
_aUniversities and Colleges _xDissertations |
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| 650 | 0 | _aTheses | |
| 856 | 4 | 0 |
_uhttp://ecollib.ump.edu.my/id/eprint/3941 _zAccess in library only |
| 999 |
_aVIRTUA40 _c6924 _d6930 |
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| 999 | _aVTLSSORT0080*0200*0400*0900*0901*1000*2450*2600*3000*5000*5001*5020*5200*5380*6100*6500*6501*8560*9992 | ||