| 000 | 00931nam a2200265 a 4500 | ||
|---|---|---|---|
| 001 | vtls000073882 | ||
| 003 | KUKTEM | ||
| 005 | 20251125095312.0 | ||
| 008 | 130816t2013 nyua f 001 0 eng d | ||
| 020 | _a9781461419624 (hbk.) | ||
| 039 | 9 |
_a201406021024 _bsaini _y201308161018 _zida |
|
| 040 | _aUMP | ||
| 090 | _aTK7874 .J53 2013 | ||
| 100 | 1 | _aJiang, Guosheng | |
| 245 | 1 | 0 |
_aAdvanced thermal management materials / _cGuosheng Jiang, Liyong Diao, Ken Kuang |
| 260 |
_aNew York, NY : _bSpringer, _c2013 |
||
| 300 |
_axi, 154 p. : _bill. ; _c24 cm. |
||
| 504 | _aIncludes bibliographical references and index | ||
| 650 | 0 |
_aMicroelectronic packaging _xMaterials _xThermal properties |
|
| 650 | 0 |
_aMicroelectronics _xCooling |
|
| 650 | 0 | _aHeat sinks (Electronics) | |
| 700 | 1 | _aDiao, Liyong | |
| 700 | 1 | _aKuang, Ken | |
| 999 |
_aVIRTUA40 _c70045 _d70051 |
||
| 999 | _aVTLSSORT0080*0200*0400*0900*1000*2450*2600*3000*5040*6500*6501*6502*7000*7001*9992 | ||