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008 171102s2017 my da f abm 000 0 eng d
020 _aTHE0000139(Local)
039 9 _a201905131249
_bnazirah
_c201712141239
_dnazri
_y201711021005
_zsaini
040 _aUMP
090 _aFIST .F374 2017 r Bc.
100 0 _aNor Fashilin Azahar
245 1 0 _aStudy on preparation and properties of hybrid kenaf fiber and sawdust particleboard composite /
_cNor Fashilin Azahar
260 _aKuantan, Pahang :
_bUMP,
_c2017
300 _axvi, 24 p. :
_bill. (some col.), charts ;
_c30 cm. +
_e1 CD-ROM
500 _aFaculty of Industrial Sciences and Technology
502 _aProject Paper (Bachelor of Applied Science (Honor) Material Technology) -- Universiti Malaysia Pahang – 2017
504 _aBibliography : p. 24
520 3 _aThis thesis reports study of Hybrid kenaf fiber and Sawdust particleboard composite using urea formaldehyde and phenol formaldehyde and its physical and chemical properties. Hybrid particleboard are introduced as an alternative for traditional particleboard. The objectives of this research are to prepare hybrid kenaf fiber and sawdust particleboard composite, to determine the physical and mechanical properties of hybrid kenaf fiber and sawdust particleboard composite and to characterize hybrid kenaf fiber and sawdust particleboard composite by using scanning electron microscopy (SEM) and thermogravimetric analysis (TGA). Hybrid kenaf and sawdust particleboard are formed by mixing kenaf fiber and sawdust particle together with urea formaldehyde (UF) or phenol formaldehyde (PF). Before mixing with resin, both kenaf fiber and sawdust particleboard are needed to be grind to obtain powder form. After mixing with resin, the particleboard then placed into a mold and hot pressed. Then, the particleboard undergo conditioning for one week before being cut for physical and mechanical testing. Then, the kenaf fiber particleboard is characterized by using Thermogravimetric Analysis (TGA) and Scanning Electron Microscopy (SEM). Hybrid particleboard with phenol formaldehyde do not swell too much and hybrid particleboard with urea formaldehyde has higher tensile strength. From the SEM images, the UF resin and PF resin used are identified. After being tested, hybrid particleboard with phenol formaldehyde has better bond than hybrid particleboard with urea formaldehyde.
610 2 0 _aFaculty of Industrial Sciences and Technology
_xDissertations
650 0 _aUniversities and Colleges
_xDissertations
650 0 _aTheses
856 4 0 _uhttp://ecollib.ump.edu.my/id/eprint/28005
_zAccess in library only
999 _aVIRTUA40
_c7611
_d7617
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