000 01080nam a2200277 i 4500
001 vtls000102156
003 KUKTEM
005 20251125103645.0
008 171026s2017 njua f 001 0 eng d
020 _a9781119045939
_qhardback
039 9 _a201802071522
_bnazri
_y201710261524
_znadia
040 _aUMP
_beng
_cUMP
_erda
090 _aTK7874 .L57 2017
100 1 _aLi, Suny,
_eauthor.
245 1 0 _aSiP-system in package design and simulation :
_bMentor EE Flow Advanced Design Guide /
_cSuny Li
264 1 _aHoboken, NJ :
_bPublishing House of Electronics Industry/Wiley,
_c2017
264 4 _c© 2017
300 _axvii, 477 pages :
_billusrations ;
_c25 cm.
336 _atext
_2rdacontent
337 _aunmediated
_2rdamedia
338 _avolume
_2rdacarrier
504 _aIncludes bibliographical references and index
650 0 _aIntegrated circuits
_xDesign and construction
650 0 _aMultichip modules (Microelectronics)
_xDesign and construction
999 _aVIRTUA40
_c87321
_d87327
999 _aVTLSSORT0080*0200*0400*0900*1000*2450*2640*2641*3000*3360*3370*3380*5040*6500*6501*9992