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_c93603 _d93609 |
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| 003 | MY-KuUP | ||
| 005 | 20251125105654.0 | ||
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| 007 | cr ||||||||||| | ||
| 008 | 200529s2020 si fs |||| 0|eng d | ||
| 020 |
_a9789811539206 _qebook |
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| 040 |
_aUMP _beng _cUMP _erda |
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| 090 | _aTK7800 .L38 2020 | ||
| 100 | 1 |
_aLau, John H., _eauthor. |
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| 245 | 1 | 0 |
_aAssembly and reliability of lead-free solder joints / _cby John H. Lau, Ning-Cheng Lee |
| 250 | _a1st ed. 2020. | ||
| 264 | 1 |
_aSingapore : _bSpringer Singapore : _bImprint: Springer, _c2020 |
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| 300 | _a1 online resource | ||
| 336 |
_atext _2rdacontent |
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| 337 |
_acomputer _2rdamedia |
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| 338 |
_aonline resource _2rdacarrier |
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| 347 |
_atext file _bPDF _2rda |
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| 650 | 0 | _aElectronics | |
| 650 | 0 | _aMicroelectronics | |
| 650 | 0 | _aElectronic circuits | |
| 700 | 1 |
_aLee, Ning-Cheng, _eauthor. |
|
| 856 | 4 | 0 |
_uhttps://link-springer-com.libraryumpsa.idm.oclc.org/book/10.1007/978-981-15-3920-6 _zOff-Campus link |
| 856 | 4 | 0 |
_uhttps://link.springer.com/book/10.1007/978-981-15-3920-6 _zClick here to access (Direct Link) |
| 942 |
_2lcc _cEBOOK |
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