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_c93958 _d93964 |
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| 003 | MY-KuUP | ||
| 005 | 20251125105714.0 | ||
| 006 | a||||fs|||| 000 0 | ||
| 007 | cr ||||||||||| | ||
| 008 | 191214s2020 si fs 000 0 eng d | ||
| 020 |
_a9789811501739 _qebook |
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| 040 |
_aOhioLINK _beng _cUMP _erda |
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| 090 | _aTK153 .M63 2020 | ||
| 245 | 0 | 0 |
_aModeling and application of electromagnetic and thermal field in electrical engineering / _cZhiguang Cheng, Norio Takahashi, Behzad Forghani, editors |
| 264 | 1 |
_aSingapore : _bSpringer, _c2020 |
|
| 300 | _a1 online resource | ||
| 336 |
_atext _2rdacontent |
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| 337 |
_acomputer _2rdamedia |
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| 338 |
_aonline resource _2rdacarrier |
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| 650 | 0 | _aElectrical engineering | |
| 700 | 1 |
_aCheng, Zhiguang, _eeditor. |
|
| 700 | 1 |
_aTakahashi, Norio, _eeditor. |
|
| 700 | 1 |
_aForghani, Behzad, _eeditor. |
|
| 856 | 4 | 0 |
_uhttps://link-springer-com.libraryumpsa.idm.oclc.org/book/10.1007/978-981-15-0173-9 _zOff-campus link |
| 856 | 4 | 0 |
_uhttps://link.springer.com/book/10.1007/978-981-15-0173-9 _zClick here (Direct link) |
| 942 |
_2lcc _cEBOOK |
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