000 01237nam a2200349 i 4500
999 _c94072
_d94078
003 MY-KuUP
005 20251125105720.0
006 a||||fo|||| 000 0
007 cr |||||||||||
008 190907s2020 sz fob 000 0 eng d
020 _a9783030252014
_qebook
040 _aEBLCP
_beng
_cUMP
_erda
090 _aTA418.54 .C44 2020
100 1 _aChen, Zengtao,
_eauthor.
245 1 0 _aAdvanced thermal stress analysis of smart materials and structures / \
_cZengtao Chen, Abdolhamid Akbarzadeh
264 1 _aCham :
_bSpringer,
_c2020
300 _a1 online resource
336 _atext
_2rdacontent
337 _acomputer
_2rdamedia
338 _aonline resource
_2rdacarrier
490 1 _aStructural integrity
504 _aIncludes bibliographical references
650 0 _aSmart materials
650 0 _aSmart structures
650 0 _aThermal stresses
650 0 _aMaterials
_xThermal conductivity
700 1 _aAkbarzadeh, Abdolhamid,
_eauthor.
830 0 _aStructural integrity
856 4 9 _uhttps://link-springer-com.libraryumpsa.idm.oclc.org/book/10.1007/978-3-030-25201-4
_zOff-Campus link
856 4 9 _uhttps://www.springer.com/gp/book/9783030252007
_zClick here to access (Direct Link)
942 _2lcc
_cEBOOK