| 000 | 01058nam a2200313 i 4500 | ||
|---|---|---|---|
| 999 |
_c99180 _d99186 |
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| 003 | MY-KuUP | ||
| 005 | 20251125110246.0 | ||
| 006 | a||||fr|||| 001 0 | ||
| 007 | ta | ||
| 008 | 230314t20172017-uka|||fr|||| 001 0 eng d | ||
| 020 |
_a9781788021487 _qpaperback |
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| 020 |
_a1788021487 _qpaperback |
||
| 040 |
_aMalcat _beng _cUMP _erda |
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| 090 | _aTK7871.85 .W45 2017 f | ||
| 245 | 1 | 0 |
_aSemiconductor material and device characterization / _ccontributors: Wei Du, Feng Zhao, et al. |
| 264 | 1 |
_aUnited Kingdom : _bAuris Reference Limited, _c2017 |
|
| 264 | 4 | _c©2017 | |
| 300 |
_aix, 200 pages : _billustration ; _c31 cm |
||
| 336 |
_2rdacontent _atext |
||
| 337 |
_2rdamedia _aunmediated |
||
| 338 |
_2rdacarrier _avolume |
||
| 504 | _aIncludes bibliographical references and index | ||
| 650 | 0 | _aSemiconductors. | |
| 650 | 0 |
_aSemiconductors _xTesting. |
|
| 700 |
_aDu, Wei. _econtributors. |
||
| 700 |
_aZhao, Feng. _econtributors. |
||
| 942 |
_2lcc _cOPEN |
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