Joint solder of lead free solder (Sn0.7Cu) and prrinted circuit board with various heat treatment temperatures /

Ariff Syakirin Ghazalli

Joint solder of lead free solder (Sn0.7Cu) and prrinted circuit board with various heat treatment temperatures / Ariff Syakirin Bin Ghazalli - Kuantan, Pahang : UMP, 2007 - 50 p. : ill. (some col.) ; 30 cm.

Project paper (Bachelor of Mechanical Engineering) -- Universiti Malaysia Pahang - 2007

THE0006900(Local)


Solder and soldering
Printed circuits

Perpustakaan Universiti Malaysia Pahang Al-Sultan Abdullah
26600 Pekan, Pahang Darul Makmur
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Email: umplibrary@umpsa.edu.my

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