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Joint solder of lead free solder (Sn0.7Cu) and prrinted circuit board with various heat treatment temperatures / Ariff Syakirin Bin Ghazalli

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Material type: Text

TextPublication details: Kuantan, Pahang : UMP, 2007Description: 50 p. : ill. (some col.) ; 30 cmISBN:

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Dissertation note: Project paper (Bachelor of Mechanical Engineering) -- Universiti Malaysia Pahang - 2007

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Holdings
Item type	Current library	Call number	Copy number	Status	Date due	Barcode
Final Year Report	UMPLIB PEKAN	TK7868.P7 A75 2007 rs Bc. (Browse shelf(Opens below))	1	Digitized Process		0000037937

Project paper (Bachelor of Mechanical Engineering) -- Universiti Malaysia Pahang - 2007