Wire bonding in microelectronics /
Harman, George G.
Wire bonding in microelectronics / George G. Harmon - 3rd ed. - New York : McGraw-Hill, 2010 - xx, 426 p. : ill. ; 24 cm. + 1 CD-ROM
Includes bibliographical references and index
9780071476232 0071476237 9780071701013 (hbk.) 007170101X (hbk.)
Wire bonding (Electronic packaging)--Production control
Electronic packaging--Reliability
Electronic packaging--Defects
Semiconductors--Failures
Wire bonding in microelectronics / George G. Harmon - 3rd ed. - New York : McGraw-Hill, 2010 - xx, 426 p. : ill. ; 24 cm. + 1 CD-ROM
Includes bibliographical references and index
9780071476232 0071476237 9780071701013 (hbk.) 007170101X (hbk.)
Wire bonding (Electronic packaging)--Production control
Electronic packaging--Reliability
Electronic packaging--Defects
Semiconductors--Failures