MARC details
| 000 -LEADER |
|---|
| fixed length control field |
01083nam a2200301 a 4500 |
| 001 - CONTROL NUMBER |
|---|
| control field |
vtls000056160 |
| 003 - CONTROL NUMBER IDENTIFIER |
|---|
| control field |
KUKTEM |
| 005 - DATE AND TIME OF LATEST TRANSACTION |
|---|
| control field |
20251117144511.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
|---|
| fixed length control field |
111121t2010 nyua f 001 0 eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
|---|
| International Standard Book Number |
9780071476232 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
|---|
| International Standard Book Number |
0071476237 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
|---|
| International Standard Book Number |
9780071701013 (hbk.) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
|---|
| International Standard Book Number |
007170101X (hbk.) |
| 039 #9 - LEVEL OF BIBLIOGRAPHIC CONTROL AND CODING DETAIL [OBSOLETE] |
|---|
| Level of rules in bibliographic description |
201202161529 |
| Level of effort used to assign nonsubject heading access points |
asmadi |
| Level of effort used to assign subject headings |
201111211138 |
| Level of effort used to assign classification |
sri |
| Level of effort used to assign subject headings |
201111211135 |
| Level of effort used to assign classification |
sri |
| -- |
201111211132 |
| -- |
sri |
| 040 ## - CATALOGING SOURCE |
|---|
| Original cataloging agency |
UMP |
| 090 ## - LOCALLY ASSIGNED LC-TYPE CALL NUMBER (OCLC); LOCAL CALL NUMBER (RLIN) |
|---|
| Classification number (OCLC) (R) ; Classification number, CALL (RLIN) (NR) |
TK7836 .H37 2010 |
| 100 1# - MAIN ENTRY--PERSONAL NAME |
|---|
| Personal name |
Harman, George G. |
| 245 10 - TITLE STATEMENT |
|---|
| Title |
Wire bonding in microelectronics / |
| Statement of responsibility, etc. |
George G. Harmon |
| 250 ## - EDITION STATEMENT |
|---|
| Edition statement |
3rd ed. |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. |
|---|
| Place of publication, distribution, etc. |
New York : |
| Name of publisher, distributor, etc. |
McGraw-Hill, |
| Date of publication, distribution, etc. |
2010 |
| 300 ## - PHYSICAL DESCRIPTION |
|---|
| Extent |
xx, 426 p. : |
| Other physical details |
ill. ; |
| Dimensions |
24 cm. + |
| Accompanying material |
1 CD-ROM |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE |
|---|
| Bibliography, etc. note |
Includes bibliographical references and index |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Wire bonding (Electronic packaging) |
| General subdivision |
Production control |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Electronic packaging |
| General subdivision |
Reliability |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Electronic packaging |
| General subdivision |
Defects |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Semiconductors |
| General subdivision |
Failures |