LCP for microwave packages and modules /
LCP for microwave packages and modules /
edited by Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara
- Cambridge : Cambridge University Press, 2012
- xiv, 253 p. : ill. ; 26 cm.
- The Cambridge RF and microwave engineering series .
Includes bibliographical references and index
Machine generated contents note: 1. Introduction; 2. Characteristics of liquid crystal polymer (LCP) Morgan J. Chen, Kunia Aihara, Cheng Chen and Anh-Vu H. Pham; 3. Fabrication techniques for processing LCP laminates; 4. LCP for wafer level chip scale MEMS; 5. LCP for surface mount interconnects, packages, and modules; 6. LCP for passive components Hai Ta, Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 7. LCP for system design Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 8. LCP reliability
9781107003781 (hardback)
Microwave devices--Materials
Microelectronic packaging--Materials
Liquid crystal devices
Polymer liquid crystals
Includes bibliographical references and index
Machine generated contents note: 1. Introduction; 2. Characteristics of liquid crystal polymer (LCP) Morgan J. Chen, Kunia Aihara, Cheng Chen and Anh-Vu H. Pham; 3. Fabrication techniques for processing LCP laminates; 4. LCP for wafer level chip scale MEMS; 5. LCP for surface mount interconnects, packages, and modules; 6. LCP for passive components Hai Ta, Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 7. LCP for system design Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 8. LCP reliability
9781107003781 (hardback)
Microwave devices--Materials
Microelectronic packaging--Materials
Liquid crystal devices
Polymer liquid crystals