LCP for microwave packages and modules / edited by Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara

Contributor(s):

Material type: Text

TextSeries: The Cambridge RF and microwave engineering seriesPublication details: Cambridge : Cambridge University Press, 2012Description: xiv, 253 p. : ill. ; 26 cmISBN:

9781107003781 (hardback)

Subject(s):

Contents:

Machine generated contents note: 1. Introduction; 2. Characteristics of liquid crystal polymer (LCP) Morgan J. Chen, Kunia Aihara, Cheng Chen and Anh-Vu H. Pham; 3. Fabrication techniques for processing LCP laminates; 4. LCP for wafer level chip scale MEMS; 5. LCP for surface mount interconnects, packages, and modules; 6. LCP for passive components Hai Ta, Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 7. LCP for system design Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 8. LCP reliability

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Holdings ( 1 )
Title notes ( 2 )

Holdings
Item type	Current library	Call number	Copy number	Status	Date due	Barcode
Open Shelf	UMPLIB PEKAN	TK7876 .L37 2012 (Browse shelf(Opens below))	1	Available		0000071775

Includes bibliographical references and index