Design-for-test and test optimization techniques for TSV- based 3D stacked ICs /
Noia, Brandon
Design-for-test and test optimization techniques for TSV- based 3D stacked ICs / Brandon Noia, Krishnendu Chakrabarty ; foreword by Vishwani Agrawal - Cham : Springer, 2014 - xviii, 247 p.) : ill. (some col.) ; 24 cm.
Includes bibliographical references
9783319023779 (hbk.)
Three-dimensional integrated circuits--Design and construction
Three-dimensional integrated circuits--Testing
Design-for-test and test optimization techniques for TSV- based 3D stacked ICs / Brandon Noia, Krishnendu Chakrabarty ; foreword by Vishwani Agrawal - Cham : Springer, 2014 - xviii, 247 p.) : ill. (some col.) ; 24 cm.
Includes bibliographical references
9783319023779 (hbk.)
Three-dimensional integrated circuits--Design and construction
Three-dimensional integrated circuits--Testing