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Design-for-test and test optimization techniques for TSV- based 3D stacked ICs / Brandon Noia, Krishnendu Chakrabarty ; foreword by Vishwani Agrawal

By: Contributor(s): Material type: TextTextPublication details: Cham : Springer, 2014Description: xviii, 247 p.) : ill. (some col.) ; 24 cmISBN:
  • 9783319023779 (hbk.)
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Holdings
Item type Current library Call number Copy number Status Date due Barcode
Open Shelf Open Shelf UMPLIB PEKAN TK7874.893 .N65 2014 (Browse shelf(Opens below)) 1 Available 0000100394

Includes bibliographical references

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