MARC details
| 000 -LEADER |
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| fixed length control field |
02042nam a2200253 a 4500 |
| 001 - CONTROL NUMBER |
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| control field |
vtls000077299 |
| 003 - CONTROL NUMBER IDENTIFIER |
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| control field |
KUKTEM |
| 005 - DATE AND TIME OF LATEST TRANSACTION |
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| control field |
20251125102832.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
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| fixed length control field |
140407t2014 nyua f 001 0 eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
|---|
| International Standard Book Number |
9781461417606 (hbk.) |
| 039 #9 - LEVEL OF BIBLIOGRAPHIC CONTROL AND CODING DETAIL [OBSOLETE] |
|---|
| Level of rules in bibliographic description |
201507031655 |
| Level of effort used to assign nonsubject heading access points |
aida |
| Level of effort used to assign subject headings |
201506251156 |
| Level of effort used to assign classification |
aida |
| -- |
201404071448 |
| -- |
irma |
| 040 ## - CATALOGING SOURCE |
|---|
| Original cataloging agency |
UMP |
| 090 ## - LOCALLY ASSIGNED LC-TYPE CALL NUMBER (OCLC); LOCAL CALL NUMBER (RLIN) |
|---|
| Classification number (OCLC) (R) ; Classification number, CALL (RLIN) (NR) |
TK7867 .B35 2014 |
| 100 1# - MAIN ENTRY--PERSONAL NAME |
|---|
| Personal name |
Balasinski, Artur |
| 245 10 - TITLE STATEMENT |
|---|
| Title |
Design for manufacturability: |
| Remainder of title |
from 1D to 4D for 90-22 nm technology nodes / |
| Statement of responsibility, etc. |
Artur Balasinski |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. |
|---|
| Place of publication, distribution, etc. |
New York : |
| Name of publisher, distributor, etc. |
Springer, |
| Date of publication, distribution, etc. |
2014 |
| 300 ## - PHYSICAL DESCRIPTION |
|---|
| Extent |
viii, 278 p. : |
| Other physical details |
ill. (some col.) ; |
| Dimensions |
24 cm. |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE |
|---|
| Bibliography, etc. note |
Includes bibliographical references |
| 505 0# - FORMATTED CONTENTS NOTE |
|---|
| Formatted contents note |
Classic DfM: from 2D to 3D -- DfM at 28 nm and Beyond -- New DfM Domain: Stress Effects -- Conclusions and Future Work |
| 520 ## - SUMMARY, ETC. |
|---|
| Summary, etc. |
This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes. It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package. Provides design for manufacturability guidelines on layout techniques for the most advanced, 22 nm technology nodes; Includes information valuable to layout designers, packaging engineers and quality engineers, working on memories, logic, system-on-chip and system-in-package; Offers a highly-accessible, single-source reference to information otherwise available only from disparate sources; Helps readers to translate reliability methodology into real design flows |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Electronic circuit design |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Integrated circuits |
| General subdivision |
Design |