Advanced MEMS packaging [electronic resource] / John H. Lau ... [et al.]
Material type:
TextPublication details: New York : McGraw-Hill, c2010Description: 1 online resource (xxiii, 552 p.) : illISBN: - 9780071627924 (NetLibrary e-ISBN)
- 0071627928 (NetLibrary e-ISBN)
- 9780071741835 (McGraw-Hill e-ISBN)
- 0071741836 (McGraw-Hill e-ISBN)
| Item type | Current library | Call number | Copy number | Status | Date due | Barcode | |
|---|---|---|---|---|---|---|---|
E-book
|
UMPLIB GAMBANG | TK7875 .A39 2010 (Browse shelf(Opens below)) | 1 | Not for loan | 0000055621 |
Description based on print version record
Includes bibliographical references and index
Enabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices
Mode of acceess : Internet