Amazon cover image
Image from Amazon.com

Materials, processes, integration and reliability in advanced interconnects for micro- and nanoelectronics : symposium held April 10-12, 2007, San Francisco, California, U.S.A. / editors: Qinghuang Lin ... [et al.]

By: Contributor(s): Material type: TextTextSeries: Materials Research Society symposia proceedings ; v. 990Publication details: Warrendale, PA : Materials Research Society, 2007Description: xiv, 338 p. : ill. ; 24 cmISBN:
  • 9781558999503
  • 1558999507
Subject(s):
Tags from this library: No tags from this library for this title. Log in to add tags.
Star ratings
    Average rating: 0.0 (0 votes)
Holdings
Item type Current library Call number Copy number Status Date due Barcode
Open Shelf Open Shelf UMPLIB PEKAN TK7874.53 .S96 2007 (Browse shelf(Opens below)) 1 Available 0000071729

Includes bibliographical references and indexes

Perpustakaan Universiti Malaysia Pahang Al-Sultan Abdullah
26600 Pekan, Pahang Darul Makmur
Phone: +609 431 5063 (Gambang) / +609 431 5035 (Pekan)
Email: umplibrary@umpsa.edu.my

Connect With Us