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Materials, integration and packaging issues for high-frequency devices : symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A. / editors, P. Muralt ... [et al.]
Material type:
TextSeries: Materials Research Society symposia proceedings ; v. 783Publication details: Warrendale, PA : Materials Research Society, 2004Description: xiii, 232 p. : ill. ; 24 cmISBN: - 9781558997219
- 1558997210
| Item type | Current library | Call number | Copy number | Status | Date due | Barcode | |
|---|---|---|---|---|---|---|---|
Open Shelf
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UMPLIB PEKAN | TK7870.15 .M38 2004 (Browse shelf(Opens below)) | 1 | Available | 0000071749 |
Includes bibliographical references and indexes