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Wire bonding in microelectronics / George G. Harmon by
Edition: 3rd ed.
Material type: Text Text; Format: print ; Literary form: Not fiction ; Audience: Specialized;
Publication details: New York : McGraw-Hill, 2010
Availability: Items available for loan: UMPLIB PEKAN (2)Call number: TK7836 .H37 2010, ...

Practical guide to the packaging of electronics : thermal and mechanical design and analysis / Ali Jamnia by
Edition: 2nd ed.
Material type: Text Text; Format: print ; Literary form: Not fiction ; Audience: Specialized;
Publication details: Boca Raton : CRC Press, c2009
Online resources:
Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7870.15 .J36 2009.

Power electronic packaging : design, assembly process, reliability and modeling / Yong Liu by
Material type: Text Text; Format: print ; Literary form: Not fiction ; Audience: Specialized;
Publication details: New York : Springer, c2012
Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7870.15 .L58 2012.

Nanopackaging : nanotechnologies and electronics packaging / James E. Morris, editor by
Material type: Text Text; Format: print ; Literary form: Not fiction ; Audience: Specialized;
Publication details: New York, NY : Springer , 2008
Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7870.15 .N36 2008.

Materials, integration and packaging issues for high-frequency devices : symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A. / editors, P. Muralt ... [et al.] by Series: Materials Research Society symposia proceedings ; v. 783
Material type: Text Text; Format: print ; Literary form: Not fiction ; Audience: Specialized;
Publication details: Warrendale, PA : Materials Research Society, 2004
Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7870.15 .M38 2004.

LED packaging for lighting applications : design, manufacturing and testing / Sheng Liu, Xiaobing Luo by
Material type: Text Text; Format: print ; Literary form: Not fiction ; Audience: Specialized;
Publication details: Singapore : John Wiley & Sons (Asia), 2011
Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7871.89.L53 L58 2011.

Hermeticity of electronic packages / Hal Greenhouse, Robert Lowry, Bruce Romenesko by
Edition: 2nd ed.
Material type: Text Text; Format: print ; Literary form: Not fiction ; Audience: Specialized;
Publication details: Amsterdam, Netherlands : William Andrew/Elsevier, c2012
Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7870.15 .G74 2012.

Heat transfer : thermal management of electronics / Younes Shabany by
Material type: Text Text; Format: print ; Literary form: Not fiction ; Audience: Specialized;
Publication details: Boca Raton : CRC Press, c2010
Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7870.25 .S53 2010.

The handbook of machine soldering : SMT and TH / Ralph W. Woodgate by
Edition: 3rd ed.
Material type: Text Text; Format: print ; Literary form: Not fiction ; Audience: Specialized;
Publication details: New York : John Wiley & Sons, 1996
Availability: Items available for reference: UMPLIB PEKAN: Not for loan (1)Call number: TK7870.15 .W66 1996 r.

Fundamentals of microsystems packaging / Rao R. Tummala, editor by
Material type: Text Text; Format: print ; Literary form: Not fiction ; Audience: Specialized;
Publication details: New York : McGraw-Hill, c2001
Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7870.15 .F86 2001.

Encyclopedia of thermal packaging. Set 2, Thermal packaging tools / editor-in-chief Avram Bar-Cohen by
Material type: Text Text; Format: print ; Literary form: Not fiction ; Audience: Specialized;
Publication details: Singapore : World Scientific , 2015
Other title:
  • Thermal packaging tools
Availability: Items available for reference: UMPLIB GAMBANG: Not for loan (2)Call number: TK7870.15 .E53 2015 re, ... UMPLIB PEKAN: Not for loan (2)Call number: TK7870.15 .E53 2015 re, ...

Encyclopedia of thermal packaging. Set 1, Thermal packaging techniques / editor-in-chief Avram Bar-Cohen by
Material type: Text Text; Format: print ; Literary form: Not fiction ; Audience: Specialized;
Publication details: Singapore : World Scientific Pub., 2013
Availability: Items available for reference: UMPLIB GAMBANG: Not for loan (3)Call number: TK7870.15 .E53 2013 re, ... UMPLIB PEKAN: Not for loan (3)Call number: TK7870.15 .E53 2013 re, ...

Electronic techniques : shop practices and construction / Robert S. Villanucci, Alexander W. Avtgis, William F. Megow by
Edition: 7th ed.
Material type: Text Text
Publication details: Upper Saddle River, NJ: Prentice Hall, 2002
Availability: Items available for loan: UMPLIB GAMBANG (1)Call number: TK7836 .V55 2002. UMPLIB PEKAN (1)Call number: TK7836 .V55 2002.

Electronic packaging, microelectronics, and interconnection dictionary / Charles A. Harper, Martin B. Miller by Series: Electronic packaging and interconnection series
Material type: Text Text; Format: print ; Literary form: Not fiction ; Audience: Specialized;
Publication details: New York : McGraw-Hill, c1993
Availability: Items available for reference: UMPLIB PEKAN: Not for loan (1)Call number: TK7804 .H37 1993 rd.

Electronic packaging materials science X : symposium held April 14-16, 1998, San Francisco, California, U.S.A. / editors by Daniel J. Belton ... [et al.] by Series: Materials Research Society symposium proceedings
Material type: Text Text; Format: print ; Literary form: Not fiction ; Audience: Specialized;
Publication details: Pittsburgh, PA : Materials Research Society, c1998
Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7870 .E44 1998.

Electronic packaging materials science VIII : symposium held April 17-20, 1995, San Francisco, California, U.S.A. / editors, Robert C. Sundahl ... [et al.] by Series: Materials Research Society symposium proceedings
Material type: Text Text; Format: print ; Literary form: Not fiction ; Audience: Specialized;
Publication details: Pittsburgh, PA : Materials Research Society, c1995
Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7870.15 .E44 1995.

Electronic packaging materials science VII : symposium held November 29-December 3, 1993, Boston, Massachusetts, U.S.A. / editors by Peter Børgesen, Klavs F. Jensen, Roger A. Pollak by Series: Materials Research Society symposium proceedings
Material type: Text Text; Format: print ; Literary form: Not fiction ; Audience: Specialized;
Publication details: Pittsburgh, PA : Materials Research Society, c1994
Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7870.15 .E44 1994.

Electronic packaging materials science VI : symposium held April 27-30, 1992, San Francisco, California, U.S.A. / editors, Paul S. Ho ... [et al.] by Series: Materials Research Society symposium proceedings
Material type: Text Text; Format: print ; Literary form: Not fiction ; Audience: Specialized;
Publication details: Pittsburgh, PA : Materials Research Society , c1992
Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7870.15 .E44 1992.

Electronic packaging materials science V : symposium held November 26-29, 1990, Boston, Massachusetts, U.S.A. / editors, Edwin D. Lillie ... [et al.] by Series: Materials Research Society symposium proceedings ; v. 203
Material type: Text Text; Format: print ; Literary form: Not fiction ; Audience: Specialized;
Publication details: Pittsburgh, Pa. : Materials Research Society, 1991
Other title:
  • Electronic packaging materials science five
  • Electronic packaging materials science 5
Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7870.15 .E44 1991.

Electronic packaging materials science IX : symposium held December 2-5, 1996, Boston, Massachusetts, U.S.A. / editors by Steven K. Groothiuis ... [et al.] by Series: Materials Research Society symposia proceedings
Material type: Text Text; Format: print ; Literary form: Not fiction ; Audience: Specialized;
Publication details: Pittsburgh, PA : Materials Research Society, c1997
Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7870.15 .E44 1997.

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