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		Physical design for 3D integrated circuits / edited by Aida Todri-Sanial by Todri-Sanial, Aida Material type: Text; Format: print ; Literary form: Not fiction ; Audience: Specialized; Publication details: Boca Raton, FL : CRC Press, 2016 Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7874.893 .P49 2016. Place hold Log in to add tags Add to cart (remove)
		Electrical modeling and design for 3D integration : 3D integrated circuits and packaging signal integrity, power integrity, and EMC / Er-Ping Li by Li, Er-Ping Material type: Text; Format: print ; Literary form: Not fiction ; Audience: Specialized; Publication details: Hoboken, NJ : John Wiley & Sons, 2012 Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7874.893 .L54 2012. Place hold Log in to add tags Add to cart (remove)
		Design of 3D integrated circuits and systems / edited by Rohit Sharma, Krzysztof Iniewski, managing editor by Sharma, Rohit Iniewski, Krzysztof Series: Devices, circuits, and systems Material type: Text; Format: print ; Literary form: Not fiction ; Audience: Specialized; Publication details: Boca Raton, FL : CRC Press, 2015 Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7874.893 .D47 2015. Place hold Log in to add tags Add to cart (remove)
		Design-for-test and test optimization techniques for TSV- based 3D stacked ICs / Brandon Noia, Krishnendu Chakrabarty ; foreword by Vishwani Agrawal by Noia, Brandon Agrawal, Vishwani D Chakrabarty, Krishnendu Material type: Text; Format: print ; Literary form: Not fiction ; Audience: Specialized; Publication details: Cham : Springer, 2014 Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7874.893 .N65 2014. Place hold Log in to add tags Add to cart (remove)
		Design and modeling for 3D ICs and interposers / Madhavan Swaminathan, Ki Jin Han by Swaminathan, Madhavan Han, Ki Jin Material type: Text; Format: print ; Literary form: Not fiction ; Audience: General; Publication details: Singapore : World Scientific, 2014 Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7874.893 .M33 2014. Place hold Log in to add tags Add to cart (remove)
		Advances in 3D integrated circuits and systems / by Hao Yu, Chuan-Seng Tan by Yu, Hao Tan, Chuan Seng Material type: Text; Format: print ; Literary form: Not fiction ; Audience: Specialized; Publication details: New Jersey : World Scientific, 2016 Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7874.893 .Y84 2016. Place hold Log in to add tags Add to cart (remove)
		3D integration for VLSI systems / edited by Chuan Seng Tan, Kuan-Neng Chen and Steven J. Koester by Chuan, Seng Tan Chen, Kuan-Neng Koester, Steven J Material type: Text; Format: print ; Literary form: Not fiction ; Audience: Specialized; Publication details: Singapore : Pan Stanford Pub., c2012 Other title: Three D integration for VLSI systems Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7874.893 .T47 2012. Place hold Log in to add tags Add to cart (remove)
		3D IC stacking technology / Banqiu Wu, Ajay Kumar, Sesh Ramaswami, editors by Wu, Banqiu Kumar, Ajay Ramaswami, Sesh Material type: Text; Format: print ; Literary form: Not fiction ; Audience: Specialized; Publication details: New York : McGraw-Hill Professional, 2011 Availability: Items available for loan: UMPLIB GAMBANG (1)Call number: TK7874.893 .A14 2011. Place hold Log in to add tags Add to cart (remove)