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		Substrate integrated antennas and arrays / Yu Jian Cheng by Cheng, Yu Jian Material type: Text; Format: print ; Literary form: Not fiction ; Audience: Specialized; Publication details: Boca Raton, FL : CRC Press, c2016 Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7871.67 .M5 C44 2016. Place hold Log in to add tags Add to cart (remove)
		Semiconductor packaging : materials interaction and reliability / Andrea Chen, Randy Hsiao-Yu Lo. by Chen, Andrea Lo, Randy Material type: Text; Format: print ; Literary form: Not fiction ; Audience: Specialized; Publication details: Boca Raton, FL : CRC Press, c2012 Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7870.15 .C44 2012. Place hold Log in to add tags Add to cart (remove)
		Quantum-well laser array packaging : nanoscale packaging techniques / Jens W. Tomm, editor, Juan Jiménez, editor by Tomm, Jens W Jiménez, J Series: McGraw-Hill nanoscience and technology series Material type: Text; Format: print ; Literary form: Not fiction ; Audience: Specialized; Publication details: New York : McGraw-Hill, c2007 Online resources: Table of contents only Availability: Items available for loan: UMPLIB GAMBANG (1)Call number: QC176.8.Q35 Q36 2007. Place hold Log in to add tags Add to cart (remove)
		Modeling and simulation for microelectronic packaging assembly : manufacture, reliability, and testing / Sheng Liu, Yong Liu by Liu, Sheng Liu, Yong Material type: Text; Format: print ; Literary form: Not fiction ; Audience: Specialized; Publication details: Singapore : Wiley, 2011 Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7870.15 .L58 2011. Place hold Log in to add tags Add to cart (remove)
		Microwave and millimeter-wave electronic packaging / Rick Sturdivant by Sturdivant, Rick Material type: Text; Format: print ; Literary form: Not fiction ; Audience: Specialized; Publication details: Massachusetts : Artech House, 2014 Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7870.15 .S78 2014. Place hold Log in to add tags Add to cart (remove)
		MEMS packaging / edited by Tai-Ran Hsu by Hsu, Tai-Ran Series: EMIS processing series; 3 Material type: Text; Literary form: Not fiction ; Audience: General; Publication details: London: Institution of Electrical Engineers, 2004 Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7874 .M45 2004. Place hold Log in to add tags Add to cart (remove)
		MEMS/MOEMS packaging : concepts, designs, materials, and processes / Ken Gilleo by Gilleo, Ken Series: McGraw-Hill nanoscience and technology series Material type: Text; Format: print ; Literary form: Not fiction ; Audience: Specialized; Publication details: New York : McGraw-Hill, 2005 Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7870.15 .G55 2005. Place hold Log in to add tags Add to cart (remove)
		MEMS and microsystems : design, manufacture, and packaging / Tai-Ran Hsu. by Hsu, Tai-Ran Edition: 2nd ed. Material type: Text; Format: print ; Literary form: Not fiction ; Audience: Specialized; Publication details: Hoboken, NJ : John Wiley, c2008 Online resources: Table of contents only Contributor biographical information Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7874 .H79 2008. Place hold Log in to add tags Add to cart (remove)
		MEMS : fundamental technology and applications / edited by Vikas Choudhary, Krzysztof Iniewski by Choudhary, Vikas Iniewski, Krzysztof Series: Devices, circuits, and systems Material type: Text; Format: print ; Literary form: Not fiction ; Audience: Specialized; Publication details: Boca Raton, FL : CRC Press, c2013 Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7875 .M46 2013. Place hold Log in to add tags Add to cart (remove)
		Mechanical behavior of materials and structures in microelectronics : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A. / editors, Ephraim Suhir ... [et al.] by Suhir, Ephraim Series: Materials Research Society symposia proceedings ; v. 226 Material type: Text; Format: print ; Literary form: Not fiction ; Audience: Specialized; Publication details: Pittsburgh, PA : Materials Research Society, 1991 Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7874 .M43 1991. Place hold Log in to add tags Add to cart (remove)
		LCP for microwave packages and modules / edited by Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara by Pham, Anh-Vu H Chen, Morgan J Aihara, Kunia Series: The Cambridge RF and microwave engineering series Material type: Text; Format: print ; Literary form: Not fiction ; Audience: Specialized; Publication details: Cambridge : Cambridge University Press, 2012 Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7876 .L37 2012. Place hold Log in to add tags Add to cart (remove)
		Introduction to system-on-package (SOP) : miniaturization of the entire system / Rao R. Tummala, Madhavan Swaminathan by Tummala, Rao Swaminathan, Madhavan Material type: Text; Format: print ; Literary form: Not fiction ; Audience: Specialized; Publication details: New York : McGraw-Hill, c2008 Availability: Items available for loan: UMPLIB GAMBANG (1)Call number: TK7870.15 .T86 2008. UMPLIB PEKAN (1)Call number: TK7870.15 .T86 2008. Place hold Log in to add tags Add to cart (remove)
		Fundamentals of microsystems packaging / Rao R. Tummala, editor by Tummala, Rao R, 1942- Material type: Text; Format: print ; Literary form: Not fiction ; Audience: Specialized; Publication details: New York : McGraw-Hill, c2001 Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7870.15 .F86 2001. Place hold Log in to add tags Add to cart (remove)
		Fundamentals of microfabrication : the science of miniaturization / Marc J. Madou by Madou, Marc J Edition: 2nd ed. Material type: Text; Format: print ; Literary form: Not fiction ; Audience: Specialized; Publication details: Boca Raton : CRC Press, c2002 Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7836 .M33 2002. Place hold Log in to add tags Add to cart (remove)
		Advanced thermal management materials / Guosheng Jiang, Liyong Diao, Ken Kuang by Jiang, Guosheng Diao, Liyong Kuang, Ken Material type: Text; Format: print ; Literary form: Not fiction ; Audience: Specialized; Publication details: New York, NY : Springer, 2013 Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7874 .J53 2013. Place hold Log in to add tags Add to cart (remove)
		Advanced MEMS packaging [electronic resource] / John H. Lau ... [et al.] by Lau, John H Material type: Text; Format: available online ; Literary form: Not fiction ; Audience: Specialized; Publication details: New York : McGraw-Hill, c2010 Online resources: NetLibrary Availability: Items available for reference: UMPLIB GAMBANG: Not for loan (1)Call number: TK7875 .A39 2010. Log in to add tags Add to cart (remove)
		Advanced electronic packaging / edited by Richard K. Ulrich, William D. Brown by Ulrich, Richard K Brown, William D Series: IEEE Press series on microelectronic systems Edition: 2nd ed. Material type: Text; Format: print ; Literary form: Not fiction Publication details: Hoboken, NJ : Wiley, 2006 Availability: Items available for loan: UMPLIB PEKAN (1)Call number: TK7874 .A38 2006. Place hold Log in to add tags Add to cart (remove)
		3D IC stacking technology / Banqiu Wu, Ajay Kumar, Sesh Ramaswami, editors by Wu, Banqiu Kumar, Ajay Ramaswami, Sesh Material type: Text; Format: print ; Literary form: Not fiction ; Audience: Specialized; Publication details: New York : McGraw-Hill Professional, 2011 Availability: Items available for loan: UMPLIB GAMBANG (1)Call number: TK7874.893 .A14 2011. Place hold Log in to add tags Add to cart (remove)